Pulsed LASER Deposition Unit

 

Pulsed LASER Deposition is thin film deposition technique in which highly energetic pulsed LASER beam is focused on the target material in presence of vacuum or controlled background gas environment. This causes the vaporization of target material in form of plasma plume which is deposited as thin film on the substrate. Stoichiometry and roughness of the film can be controlled by manipulating LASER parameters, gas pressure inside the chamber and substrate temperature,

The unit is comprised of two parts: LASER and deposition chamber.

LASER specifications:

  • Wavelength : 248 nm

  • Pulse width : 25 nsec

  • Energy : 250 – 750 mJ

  • Repetition rate : 1 – 50 Hz

Chamber specifications:

  • Chamber consists of six target holders and one substrate holder for multilayer deposition.

  • Base pressure can be reached up to ~10-7mbar with the help of rotary and turbo molecular pump.

  • Presently highly pure oxygen is used for deposition and the pressure is controlled using mass flow controller with precession of 0.1 mbar.

  • Maximum substrate can be reached up to 750º C.

  • Completely automated deposition process.

Location:

Department Of Materials Science & Engineering,
IIT Kanpur

Contact:

Prof.Ashish Garg

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Prof. Deepak Gupta

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Figure 1