Oxidation Furnace


Thermal oxidation is a simple route to cover a silicon substrate with oxide. In microdevices oxide may be used for a variety of purposes from chemical attachment and modifiability of surfaces to using oxide as a filler material in gaps etc. in microfluidic channels with submicron accuracy level or making microcantilevers. Based on the type of oxidation thermal oxide may be categorized as dry and wet oxides. In dry oxidation pure oxygen reacts with silicon at high temperatures from 800 deg. C to about 1200 deg. C.


NET building, Department.of Mechanical Engineering
IIT Kanpur


Prof. Shantanu Bhattacharya

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